Microchannel Cooling for the LHCb VELO Upgrade I

The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Product...

Descripción completa

Detalles Bibliográficos
Autores principales: Collins, Paula, De Aguiar Francisco, Oscar Augusto, Byczynski, Wiktor, Akiba, Kazu, Bertella, Claudia, Bitadze, Alexander, Buytaert, Jan, De Capua, Stefano, Callegari, Riccardo, Catinaccio, Andrea, Charvet, Colette, Coco, Victor, Degrange, Jordan, Dumps, Raphael, Alvarez Feito, Diego, Freestone, Julian, Franco Lima, Vinicius, Gallas Torreira, Abraham Antonio, Hulsbergen, Wouter, Hynds, Daniel, Arnau Izquierdo, Gonzalo, Jans, Eddy, John, Malcolm, Jurik, Nathan Philip, Leflat, Alexander, Lemos Cid, Edgar, Lindner, Rolf, Mapelli, Alessandro, Noel, Jerome, Nomerotski, Andrey, De Oliveira, Rui, Van Overbeek, Martijn, Parkes, Chris, Petagna, Paolo, Porret, Alexandre, Roeland, Erno, Romagnoli, Giulia, De Roo, Krista, Sanders, Freek, Schneider, Thomas, Schindler, Heinrich, Schmidt, Burkhard, Schopper, Andreas, Scantlebury Smead, Luke George, Van Stenis, Miranda, Svihra, Peter, Teissandier, Benoit, Thomas, Eric, Verlaat, Bart, Castellana, Christine, Charrier, Catherine, Renaud, Denis, Rouchouze, Eric, Teisier, Jean-Francois, Brock, Matthew, Bulat, Bartosz, Button, Guillaume Stephane, Jedrychowski, Mariusz, Jalocha, Pawel, Thery, Xavier
Lenguaje:eng
Publicado: 2021
Materias:
Particle Physics - Experiment
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2022.166874
http://cds.cern.ch/record/2792295
Descripción
Sumario:The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.

Ejemplares similares