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Flow boiling of R134a and HFE-7000 in a single silicon microchannel with microstructured sidewalls
Flow boiling heat transfer is investigated in a single silicon microchannel with microstructured sidewalls using R134a (at 0.19 reduced pressure) and HFE-7000 (at 0.035 reduced pressure) as working fluids. The channel is 51 mm long with a 400μm x 400μm square cross section. Sidewall microstructures...
Autores principales: | , , , |
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Lenguaje: | eng |
Publicado: |
2021
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.ijheatmasstransfer.2021.121653 http://cds.cern.ch/record/2807911 |
Sumario: | Flow boiling heat transfer is investigated in a single silicon microchannel with microstructured sidewalls
using R134a (at 0.19 reduced pressure) and HFE-7000 (at 0.035 reduced pressure) as working fluids. The
channel is 51 mm long with a 400μm x 400μm square cross section. Sidewall microstructures in the
form of triangular cavities for the entire height of the channel were introduced during the fabrication
process. By including the cavity pattern in the photolithography mask design, high accuracy and reproducibility is ensured during the fabrication of the test sample. A smooth channel with the same geometry
but without sidewall microstructures was also fabricated. Flow boiling experimental results are presented
for both channel configurations. For R134a at mass velocity $G$ = 800 kg m$^{−2}$ s$^{−1}$, the comparison of the
boiling curves shows that: in the channel with the microstructures, the wall superheat at the onset of
nucleate boiling (ONB) is reduced from 21 K to 6 K as compared to the smooth channel. An increase of
the flow boiling heat transfer coefficient up to 40% is found in the microstructured channel, which must
be due to the increased number of active nucleation sites. Heat transfer results, flow visualizations and
comparison between R134a and HFE-7000 data provide a clearly evidence of the active role of bubble nucleation during flow boiling in microchannels. These results are of fundamental importance in the design
of next generation thermal management systems for electronics |
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