Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip

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ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electr...

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Autores principales: Lapertosa, Alessandro, Gemme, Claudia, Ravera, Simone, D M S, Sultan, Dalla Betta, Gian Franco, Gariano, Giuseppe, Vannoli, Leonardo, Samy, Md Arif Abdulla
Lenguaje:eng
Publicado: 2022
Materias:
Particle Physics - Experiment
Acceso en línea:http://cds.cern.ch/record/2815570
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author Lapertosa, Alessandro
Gemme, Claudia
Ravera, Simone
D M S, Sultan
Dalla Betta, Gian Franco
Gariano, Giuseppe
Vannoli, Leonardo
Samy, Md Arif Abdulla
author_facet Lapertosa, Alessandro
Gemme, Claudia
Ravera, Simone
D M S, Sultan
Dalla Betta, Gian Franco
Gariano, Giuseppe
Vannoli, Leonardo
Samy, Md Arif Abdulla
author_sort Lapertosa, Alessandro
collection CERN
description ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 µm2) produced by FBK have been bump bonded to ITkPixv1.1 chip at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beam.
id cern-2815570
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2022
record_format invenio
spelling cern-28155702022-07-12T20:29:20Zhttp://cds.cern.ch/record/2815570engLapertosa, AlessandroGemme, ClaudiaRavera, SimoneD M S, SultanDalla Betta, Gian FrancoGariano, GiuseppeVannoli, LeonardoSamy, Md Arif AbdullaTest of ITk 3D sensor pre-production modules with ITkPixv1.1 chipParticle Physics - ExperimentITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 µm2) produced by FBK have been bump bonded to ITkPixv1.1 chip at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beam.ATL-ITK-SLIDE-2022-278oai:cds.cern.ch:28155702022-07-12
spellingShingle Particle Physics - Experiment
Lapertosa, Alessandro
Gemme, Claudia
Ravera, Simone
D M S, Sultan
Dalla Betta, Gian Franco
Gariano, Giuseppe
Vannoli, Leonardo
Samy, Md Arif Abdulla
Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title_full Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title_fullStr Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title_full_unstemmed Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title_short Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip
title_sort test of itk 3d sensor pre-production modules with itkpixv1.1 chip
topic Particle Physics - Experiment
url http://cds.cern.ch/record/2815570
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