Cargando…
Study on transient heat transfer at metal to dielectric interfaces in the temperature range between 3.5 K and 30 K
The thermal conductivity and diffusivity across a combination of metallic and insulating layers are important thermodynamic input parameters for cooling studies of composite materials or assemblies built out of layers of different electrical and thermal conductivity. The dynamic response of such the...
| Autores principales: | , , , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
2019
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1088/1757-899x/502/1/012094 http://cds.cern.ch/record/2816667 |