Results Obtained with FBK Pixel Sensor Prototypes for the HL-LHC Tracker Upgrade of the CMS Experiment

The High Luminosity Phase of the CERN Large Hadron Collider (HL-LHC) will require an extensive upgrade of the CMS Inner Tracking system based on high radiation tolerant silicon pixel sensors capable of withstanding fluences up to $\mathrm{23 \times 10^{15} n_{eq}/cm^{2}}$ (1MeV equivalent neutrons). Thin planar and 3D pixel sensors have been recently selected by CMS to be installed in the upgraded pixel tracker. Thanks to their structure, the 3D pixel sensors have some advantages with respect to planar ones, and are presently more suitable candidates for the innermost layer of the tracker. In this presentation results obtained with FBK planar and FBK 3D sensors readout by prototype read-out chip RD53A will be shown. Both sensor types have 25x100 $\mathrm{\mu m^{2}}$ pitch and 150 $\mathrm{\mu m}$ thickness, and they were manufactured in collaboration with INFN. The sensors readout by the chip were irradiated to several fluences up to the one foreseen for HL-LHC. The analysis of collected data shows very high hit detection efficiency and good spatial resolution as measured after irradiation.