Thinning and readout during bending of a custom silicon IC

This contribution presents a solution on how to interconnect, thin and bend a monolithic integrated circuit (IC) for use in the Inner Tracker System v3 (ITS3) of the ALICE experiment at the European Organization for Nuclear Research (CERN). Verification of the system operations was done by building...

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Detalles Bibliográficos
Autores principales: Langoy, Rune, Mager, Magnus, Nguyen, Anh Tuan T, Lien, Jorgen A
Lenguaje:eng
Publicado: 2020
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1109/estc48849.2020.9229845
http://cds.cern.ch/record/2839260
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author Langoy, Rune
Mager, Magnus
Nguyen, Anh Tuan T
Lien, Jorgen A
author_facet Langoy, Rune
Mager, Magnus
Nguyen, Anh Tuan T
Lien, Jorgen A
author_sort Langoy, Rune
collection CERN
description This contribution presents a solution on how to interconnect, thin and bend a monolithic integrated circuit (IC) for use in the Inner Tracker System v3 (ITS3) of the ALICE experiment at the European Organization for Nuclear Research (CERN). Verification of the system operations was done by building a dedicated readout system. The technology is demonstrated by thinning a 30 mm x 15 mm x 130 µm monolithic active pixel sensor to 45 µm and curving the chip to a radius of 20 mm while monitoring the internal registers and current consumption.
id cern-2839260
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2020
record_format invenio
spelling cern-28392602022-11-08T13:54:05Zdoi:10.1109/estc48849.2020.9229845http://cds.cern.ch/record/2839260engLangoy, RuneMager, MagnusNguyen, Anh Tuan TLien, Jorgen AThinning and readout during bending of a custom silicon ICDetectors and Experimental TechniquesThis contribution presents a solution on how to interconnect, thin and bend a monolithic integrated circuit (IC) for use in the Inner Tracker System v3 (ITS3) of the ALICE experiment at the European Organization for Nuclear Research (CERN). Verification of the system operations was done by building a dedicated readout system. The technology is demonstrated by thinning a 30 mm x 15 mm x 130 µm monolithic active pixel sensor to 45 µm and curving the chip to a radius of 20 mm while monitoring the internal registers and current consumption.oai:cds.cern.ch:28392602020
spellingShingle Detectors and Experimental Techniques
Langoy, Rune
Mager, Magnus
Nguyen, Anh Tuan T
Lien, Jorgen A
Thinning and readout during bending of a custom silicon IC
title Thinning and readout during bending of a custom silicon IC
title_full Thinning and readout during bending of a custom silicon IC
title_fullStr Thinning and readout during bending of a custom silicon IC
title_full_unstemmed Thinning and readout during bending of a custom silicon IC
title_short Thinning and readout during bending of a custom silicon IC
title_sort thinning and readout during bending of a custom silicon ic
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1109/estc48849.2020.9229845
http://cds.cern.ch/record/2839260
work_keys_str_mv AT langoyrune thinningandreadoutduringbendingofacustomsiliconic
AT magermagnus thinningandreadoutduringbendingofacustomsiliconic
AT nguyenanhtuant thinningandreadoutduringbendingofacustomsiliconic
AT lienjorgena thinningandreadoutduringbendingofacustomsiliconic

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