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Thinning and readout during bending of a custom silicon IC
This contribution presents a solution on how to interconnect, thin and bend a monolithic integrated circuit (IC) for use in the Inner Tracker System v3 (ITS3) of the ALICE experiment at the European Organization for Nuclear Research (CERN). Verification of the system operations was done by building...
Autores principales: | , , , |
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Lenguaje: | eng |
Publicado: |
2020
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1109/estc48849.2020.9229845 http://cds.cern.ch/record/2839260 |