Cargando…
ATLAS ITk Pixel Module Bump Bond Stress Analysis
The upgrade of ATLAS for the high-luminosity LHC (HL-LHC) will among many detector components replace the tracking detector with an all-silicon tracker (ITk). The outer layers are composed of strip modules while the innermost 5 layers of ITk are composed of hybrid pixel modules mounted on carbon loc...
Autor principal: | Grosse-Knetter, Joern |
---|---|
Lenguaje: | eng |
Publicado: |
2023
|
Materias: | |
Acceso en línea: | https://dx.doi.org/10.22323/1.420.0056 http://cds.cern.ch/record/2848143 |
Ejemplares similares
-
ATLAS ITk pixel module bump bond stress analysis
por: Grosse-Knetter, Joern
Publicado: (2023) -
Understanding thermally induced stresses in ATLAS ITk Pixel modules
por: Korn, Steffen
Publicado: (2021) -
Serial powering for ATLAS ITk pixel modules
por: Chan, Jay
Publicado: (2023) -
Module development for the ATLAS ITk Pixel Detector
por: Saimpert, Matthias
Publicado: (2023) -
Module development for the ATLAS ITk Pixel Detector
por: Mobius, Silke
Publicado: (2021)