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Development of novel low-mass module concepts based on MALTA monolithic pixel sensors

The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to d...

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Detalles Bibliográficos
Autores principales: Weick, J., Dachs, F., Riedler, P., Pinto, M. Vicente Barreto, Zoubir, A.M., de Acedo, L. Flores Sanz, Asensi Tortajada, I., Dao, V., Dobrijevic, D., Pernegger, H., Van Rijnbach, M., Sharma, A., Solans Sanchez, C., de Oliveira, R., Dannheim, D., Schmidt, J.V.
Lenguaje:eng
Publicado: 2023
Materias:
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/18/04/C04003
http://cds.cern.ch/record/2854450
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author Weick, J.
Dachs, F.
Riedler, P.
Pinto, M. Vicente Barreto
Zoubir, A.M.
de Acedo, L. Flores Sanz
Asensi Tortajada, I.
Dao, V.
Dobrijevic, D.
Pernegger, H.
Van Rijnbach, M.
Sharma, A.
Solans Sanchez, C.
de Oliveira, R.
Dannheim, D.
Schmidt, J.V.
author_facet Weick, J.
Dachs, F.
Riedler, P.
Pinto, M. Vicente Barreto
Zoubir, A.M.
de Acedo, L. Flores Sanz
Asensi Tortajada, I.
Dao, V.
Dobrijevic, D.
Pernegger, H.
Van Rijnbach, M.
Sharma, A.
Solans Sanchez, C.
de Oliveira, R.
Dannheim, D.
Schmidt, J.V.
author_sort Weick, J.
collection CERN
description The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.
id cern-2854450
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2023
record_format invenio
spelling cern-28544502023-04-21T02:41:40Zdoi:10.1088/1748-0221/18/04/C04003http://cds.cern.ch/record/2854450engWeick, J.Dachs, F.Riedler, P.Pinto, M. Vicente BarretoZoubir, A.M.de Acedo, L. Flores SanzAsensi Tortajada, I.Dao, V.Dobrijevic, D.Pernegger, H.Van Rijnbach, M.Sharma, A.Solans Sanchez, C.de Oliveira, R.Dannheim, D.Schmidt, J.V.Development of novel low-mass module concepts based on MALTA monolithic pixel sensorshep-exParticle Physics - Experimentphysics.ins-detDetectors and Experimental TechniquesThe MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.arXiv:2303.05792oai:cds.cern.ch:28544502023-03-10
spellingShingle hep-ex
Particle Physics - Experiment
physics.ins-det
Detectors and Experimental Techniques
Weick, J.
Dachs, F.
Riedler, P.
Pinto, M. Vicente Barreto
Zoubir, A.M.
de Acedo, L. Flores Sanz
Asensi Tortajada, I.
Dao, V.
Dobrijevic, D.
Pernegger, H.
Van Rijnbach, M.
Sharma, A.
Solans Sanchez, C.
de Oliveira, R.
Dannheim, D.
Schmidt, J.V.
Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title_full Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title_fullStr Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title_full_unstemmed Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title_short Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
title_sort development of novel low-mass module concepts based on malta monolithic pixel sensors
topic hep-ex
Particle Physics - Experiment
physics.ins-det
Detectors and Experimental Techniques
url https://dx.doi.org/10.1088/1748-0221/18/04/C04003
http://cds.cern.ch/record/2854450
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