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Development of novel low-mass module concepts based on MALTA monolithic pixel sensors
The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to d...
Autores principales: | , , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2023
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/18/04/C04003 http://cds.cern.ch/record/2854450 |
_version_ | 1780977371779694592 |
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author | Weick, J. Dachs, F. Riedler, P. Pinto, M. Vicente Barreto Zoubir, A.M. de Acedo, L. Flores Sanz Asensi Tortajada, I. Dao, V. Dobrijevic, D. Pernegger, H. Van Rijnbach, M. Sharma, A. Solans Sanchez, C. de Oliveira, R. Dannheim, D. Schmidt, J.V. |
author_facet | Weick, J. Dachs, F. Riedler, P. Pinto, M. Vicente Barreto Zoubir, A.M. de Acedo, L. Flores Sanz Asensi Tortajada, I. Dao, V. Dobrijevic, D. Pernegger, H. Van Rijnbach, M. Sharma, A. Solans Sanchez, C. de Oliveira, R. Dannheim, D. Schmidt, J.V. |
author_sort | Weick, J. |
collection | CERN |
description | The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors. |
id | cern-2854450 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2023 |
record_format | invenio |
spelling | cern-28544502023-04-21T02:41:40Zdoi:10.1088/1748-0221/18/04/C04003http://cds.cern.ch/record/2854450engWeick, J.Dachs, F.Riedler, P.Pinto, M. Vicente BarretoZoubir, A.M.de Acedo, L. Flores SanzAsensi Tortajada, I.Dao, V.Dobrijevic, D.Pernegger, H.Van Rijnbach, M.Sharma, A.Solans Sanchez, C.de Oliveira, R.Dannheim, D.Schmidt, J.V.Development of novel low-mass module concepts based on MALTA monolithic pixel sensorshep-exParticle Physics - Experimentphysics.ins-detDetectors and Experimental TechniquesThe MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip MALTA modules have been built using Al wedge wire bonding to demonstrate the direct transfer of data from chip-to-chip and to read out the data of the entire module via one chip only. Novel technologies such as Anisotropic Conductive Films (ACF) and nanowires have been investigated to build a compact module. A lightweight flex with 17 μm trace spacing has been designed, allowing compact packaging with a direct attachment of the chip connection pads to the flex using these interconnection technologies. This contribution shows the current state of our work towards a flexible, low material, dense and reliable packaging and modularization of pixel detectors.arXiv:2303.05792oai:cds.cern.ch:28544502023-03-10 |
spellingShingle | hep-ex Particle Physics - Experiment physics.ins-det Detectors and Experimental Techniques Weick, J. Dachs, F. Riedler, P. Pinto, M. Vicente Barreto Zoubir, A.M. de Acedo, L. Flores Sanz Asensi Tortajada, I. Dao, V. Dobrijevic, D. Pernegger, H. Van Rijnbach, M. Sharma, A. Solans Sanchez, C. de Oliveira, R. Dannheim, D. Schmidt, J.V. Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title_full | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title_fullStr | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title_full_unstemmed | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title_short | Development of novel low-mass module concepts based on MALTA monolithic pixel sensors |
title_sort | development of novel low-mass module concepts based on malta monolithic pixel sensors |
topic | hep-ex Particle Physics - Experiment physics.ins-det Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1088/1748-0221/18/04/C04003 http://cds.cern.ch/record/2854450 |
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