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Electromagnetic Simulation of No-Insulation Coils Using H – $\phi$ Thin Shell Approximation
When simulating no-insulation high-temperature superconducting pancake coils with the finite element (FE) method, the high aspect ratio of the thin turn-to-turn contact layer (T2TCL) leads to unfavorable meshes in these thin layers as manifested by a high number of degrees of freedom (DoF) or mesh e...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
2023
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1109/TASC.2023.3258905 http://cds.cern.ch/record/2856847 |