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The ALICE Pixel Sensor Upgrade
The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale...
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Lenguaje: | eng |
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2023
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Acceso en línea: | https://dx.doi.org/10.22323/1.420.0026 http://cds.cern.ch/record/2871816 |
_version_ | 1780978568369537024 |
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author | Lautner, Lukas |
author_facet | Lautner, Lukas |
author_sort | Lautner, Lukas |
collection | CERN |
description | The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mmand fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 μm and held in place by carbon foam spacers, resulting in an unprecedentedmaterial budget of O(0.05%) 𝑋/𝑋0 per layer. This contribution will present the detector concept, summarise the results of the R&D; program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development. |
id | cern-2871816 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2023 |
record_format | invenio |
spelling | cern-28718162023-09-20T21:01:03Zdoi:10.22323/1.420.0026http://cds.cern.ch/record/2871816engLautner, LukasThe ALICE Pixel Sensor UpgradeDetectors and Experimental TechniquesThe inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mmand fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 μm and held in place by carbon foam spacers, resulting in an unprecedentedmaterial budget of O(0.05%) 𝑋/𝑋0 per layer. This contribution will present the detector concept, summarise the results of the R&D; program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.oai:cds.cern.ch:28718162023 |
spellingShingle | Detectors and Experimental Techniques Lautner, Lukas The ALICE Pixel Sensor Upgrade |
title | The ALICE Pixel Sensor Upgrade |
title_full | The ALICE Pixel Sensor Upgrade |
title_fullStr | The ALICE Pixel Sensor Upgrade |
title_full_unstemmed | The ALICE Pixel Sensor Upgrade |
title_short | The ALICE Pixel Sensor Upgrade |
title_sort | alice pixel sensor upgrade |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.22323/1.420.0026 http://cds.cern.ch/record/2871816 |
work_keys_str_mv | AT lautnerlukas thealicepixelsensorupgrade AT lautnerlukas alicepixelsensorupgrade |