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The ALICE Pixel Sensor Upgrade

The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale...

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Autor principal: Lautner, Lukas
Lenguaje:eng
Publicado: 2023
Materias:
Acceso en línea:https://dx.doi.org/10.22323/1.420.0026
http://cds.cern.ch/record/2871816
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author Lautner, Lukas
author_facet Lautner, Lukas
author_sort Lautner, Lukas
collection CERN
description The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mmand fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 μm and held in place by carbon foam spacers, resulting in an unprecedentedmaterial budget of O(0.05%) 𝑋/𝑋0 per layer. This contribution will present the detector concept, summarise the results of the R&D; program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.
id cern-2871816
institution Organización Europea para la Investigación Nuclear
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publishDate 2023
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spelling cern-28718162023-09-20T21:01:03Zdoi:10.22323/1.420.0026http://cds.cern.ch/record/2871816engLautner, LukasThe ALICE Pixel Sensor UpgradeDetectors and Experimental TechniquesThe inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mmand fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 μm and held in place by carbon foam spacers, resulting in an unprecedentedmaterial budget of O(0.05%) 𝑋/𝑋0 per layer. This contribution will present the detector concept, summarise the results of the R&D; program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.oai:cds.cern.ch:28718162023
spellingShingle Detectors and Experimental Techniques
Lautner, Lukas
The ALICE Pixel Sensor Upgrade
title The ALICE Pixel Sensor Upgrade
title_full The ALICE Pixel Sensor Upgrade
title_fullStr The ALICE Pixel Sensor Upgrade
title_full_unstemmed The ALICE Pixel Sensor Upgrade
title_short The ALICE Pixel Sensor Upgrade
title_sort alice pixel sensor upgrade
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.22323/1.420.0026
http://cds.cern.ch/record/2871816
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