Special EP Seminar: Integrated electronics

Over the past quarter century, integrated microelectronics and its associated support technologies have matured from use in advanced research laboratories and internal corporate developments to mainstream, off-the-shelf technologies in broad industrial use. However, with the rapid increase in both performance and density, integrated electronics continues to push the limits of design and CAD technologies. This trend will continue over the next decade, with specific emphasis on high-level synthesis techniques, new packing technologies where many chips will be integrated on a single silicon 'PCB', high-performance multiprocessing architecture, and new approaches to design verification. In this presentation, future directions in these and other areas will be presented, in the context of existing CAD vendor and ASIC technology options.