The challenge of hybridization

Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low co...

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Detalles Bibliográficos
Autor principal: Caccia, Massimo
Lenguaje:eng
Publicado: 2000
Materias:
Particle Physics - Experiment
Acceso en línea:https://dx.doi.org/10.1016/S0168-9002(01)00389-8
http://cds.cern.ch/record/483105
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author Caccia, Massimo
author_facet Caccia, Massimo
author_sort Caccia, Massimo
collection CERN
description Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics.
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institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2000
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spelling cern-4831052023-03-14T20:21:00Zdoi:10.1016/S0168-9002(01)00389-8http://cds.cern.ch/record/483105engCaccia, MassimoThe challenge of hybridizationParticle Physics - ExperimentHybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics.Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics.hep-ex/0101011oai:cds.cern.ch:4831052000
spellingShingle Particle Physics - Experiment
Caccia, Massimo
The challenge of hybridization
title The challenge of hybridization
title_full The challenge of hybridization
title_fullStr The challenge of hybridization
title_full_unstemmed The challenge of hybridization
title_short The challenge of hybridization
title_sort challenge of hybridization
topic Particle Physics - Experiment
url https://dx.doi.org/10.1016/S0168-9002(01)00389-8
http://cds.cern.ch/record/483105
work_keys_str_mv AT cacciamassimo thechallengeofhybridization
AT cacciamassimo challengeofhybridization

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