Study of indium bumps for the ATLAS pixel detector

The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the indium bum...

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Detalles Bibliográficos
Autores principales: Gemme, C, Fiorello, A M, Gagliardi, G, Gilchriese, M G D, Netchaeva, P, Rossi, L, Ruscino, E, Vernocchi, F, Varasi, M
Lenguaje:eng
Publicado: 2001
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1016/S0168-9002(01)00390-4
http://cds.cern.ch/record/516872
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author Gemme, C
Fiorello, A M
Gagliardi, G
Gilchriese, M G D
Netchaeva, P
Rossi, L
Ruscino, E
Vernocchi, F
Varasi, M
author_facet Gemme, C
Fiorello, A M
Gagliardi, G
Gilchriese, M G D
Netchaeva, P
Rossi, L
Ruscino, E
Vernocchi, F
Varasi, M
author_sort Gemme, C
collection CERN
description The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the indium bumps. (1 refs).
id cern-516872
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2001
record_format invenio
spelling cern-5168722019-09-30T06:29:59Zdoi:10.1016/S0168-9002(01)00390-4http://cds.cern.ch/record/516872engGemme, CFiorello, A MGagliardi, GGilchriese, M G DNetchaeva, PRossi, LRuscino, EVernocchi, FVarasi, MStudy of indium bumps for the ATLAS pixel detectorDetectors and Experimental TechniquesThe bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the indium bumps. (1 refs).oai:cds.cern.ch:5168722001
spellingShingle Detectors and Experimental Techniques
Gemme, C
Fiorello, A M
Gagliardi, G
Gilchriese, M G D
Netchaeva, P
Rossi, L
Ruscino, E
Vernocchi, F
Varasi, M
Study of indium bumps for the ATLAS pixel detector
title Study of indium bumps for the ATLAS pixel detector
title_full Study of indium bumps for the ATLAS pixel detector
title_fullStr Study of indium bumps for the ATLAS pixel detector
title_full_unstemmed Study of indium bumps for the ATLAS pixel detector
title_short Study of indium bumps for the ATLAS pixel detector
title_sort study of indium bumps for the atlas pixel detector
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1016/S0168-9002(01)00390-4
http://cds.cern.ch/record/516872
work_keys_str_mv AT gemmec studyofindiumbumpsfortheatlaspixeldetector
AT fiorelloam studyofindiumbumpsfortheatlaspixeldetector
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AT netchaevap studyofindiumbumpsfortheatlaspixeldetector
AT rossil studyofindiumbumpsfortheatlaspixeldetector
AT ruscinoe studyofindiumbumpsfortheatlaspixeldetector
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