Conductive Cooling of SDD and SSD Front-End Chips for ALICE

We present analysis, technology developments and test results of the heat drain system of the SDD and SSD front-end electronics for the ALICE Inner Tracker System (ITS). Application of super thermoconductive carbon fibre thin plates provides a practical solution for the development of miniature motherboards for the FEE chips situated inside the sensitive ITS volume. Unidirectional carbon fibre motherboards of 160 -300 micron thickness ensure the mounting of the FEE chips and an efficient heat sink to the cooling arteries. Thermal conductivity up to 1.3 times better than copper is achieved while preserving a negligible multiple scattering contribution by the material (less than 0.15 percent of X/Xo).