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Detector modules for the endcaps of the ATLAS semiconductor tracker

The endcaps of the ATLAS Semiconductor Tracker will be composed of about 2000 detector modules of three different layouts. Up to four single-sided sensors are glued back-to-back with a small stereo angle to form double-sided modules. Five different wedge shaped sensor designs are needed, with a stri...

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Autor principal: Moorhead, G F
Lenguaje:eng
Publicado: 2002
Materias:
Acceso en línea:https://dx.doi.org/10.1016/S0168-9002(02)00529-6
http://cds.cern.ch/record/590839
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author Moorhead, G F
author_facet Moorhead, G F
author_sort Moorhead, G F
collection CERN
description The endcaps of the ATLAS Semiconductor Tracker will be composed of about 2000 detector modules of three different layouts. Up to four single-sided sensors are glued back-to-back with a small stereo angle to form double-sided modules. Five different wedge shaped sensor designs are needed, with a strip pitch varying in the range from 55 to 95 mu m. The sensors are read out by a copper/Kapton multilayer hybrid which carries 12 binary read-out ASICs and all components for the optical transmission of commands and data. Within the tight constraints imposed by the need for radiation hardness, high rate capability, low mass, low cost and overlap between neighbouring modules for detector hermiticity the design has been optimised for a thermal split between the read-out chips and the silicon sensors. The performance of prototype modules stand-alone, in multi-module system tests and in the testbeam will be shown. (9 refs).
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institution Organización Europea para la Investigación Nuclear
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publishDate 2002
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spelling cern-5908392019-09-30T06:29:59Zdoi:10.1016/S0168-9002(02)00529-6http://cds.cern.ch/record/590839engMoorhead, G FDetector modules for the endcaps of the ATLAS semiconductor trackerDetectors and Experimental TechniquesThe endcaps of the ATLAS Semiconductor Tracker will be composed of about 2000 detector modules of three different layouts. Up to four single-sided sensors are glued back-to-back with a small stereo angle to form double-sided modules. Five different wedge shaped sensor designs are needed, with a strip pitch varying in the range from 55 to 95 mu m. The sensors are read out by a copper/Kapton multilayer hybrid which carries 12 binary read-out ASICs and all components for the optical transmission of commands and data. Within the tight constraints imposed by the need for radiation hardness, high rate capability, low mass, low cost and overlap between neighbouring modules for detector hermiticity the design has been optimised for a thermal split between the read-out chips and the silicon sensors. The performance of prototype modules stand-alone, in multi-module system tests and in the testbeam will be shown. (9 refs).oai:cds.cern.ch:5908392002
spellingShingle Detectors and Experimental Techniques
Moorhead, G F
Detector modules for the endcaps of the ATLAS semiconductor tracker
title Detector modules for the endcaps of the ATLAS semiconductor tracker
title_full Detector modules for the endcaps of the ATLAS semiconductor tracker
title_fullStr Detector modules for the endcaps of the ATLAS semiconductor tracker
title_full_unstemmed Detector modules for the endcaps of the ATLAS semiconductor tracker
title_short Detector modules for the endcaps of the ATLAS semiconductor tracker
title_sort detector modules for the endcaps of the atlas semiconductor tracker
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1016/S0168-9002(02)00529-6
http://cds.cern.ch/record/590839
work_keys_str_mv AT moorheadgf detectormodulesfortheendcapsoftheatlassemiconductortracker