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New results on diamond pixel sensors using ATLAS frontend electronics
Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at...
Autores principales: | , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2003
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/S0168-9002(02)02025-9 http://cds.cern.ch/record/624600 |
_version_ | 1780900491628118016 |
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author | Keil, Markus Adam, W Berdermann, E Bergonzo, P de Boer, Wim Bogani, F Borchi, E Brambilla, A Bruzzi, Mara Colledani, C Conway, J D'Angelo, P Dabrowski, W Delpierre, P A Dulinski, W |
author_facet | Keil, Markus Adam, W Berdermann, E Bergonzo, P de Boer, Wim Bogani, F Borchi, E Brambilla, A Bruzzi, Mara Colledani, C Conway, J D'Angelo, P Dabrowski, W Delpierre, P A Dulinski, W |
author_sort | Keil, Markus |
collection | CERN |
description | Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented. |
id | cern-624600 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2003 |
record_format | invenio |
spelling | cern-6246002019-09-30T06:29:59Zdoi:10.1016/S0168-9002(02)02025-9http://cds.cern.ch/record/624600engKeil, MarkusAdam, WBerdermann, EBergonzo, Pde Boer, WimBogani, FBorchi, EBrambilla, ABruzzi, MaraColledani, CConway, JD'Angelo, PDabrowski, WDelpierre, P ADulinski, WNew results on diamond pixel sensors using ATLAS frontend electronicsDetectors and Experimental TechniquesDiamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.oai:cds.cern.ch:6246002003 |
spellingShingle | Detectors and Experimental Techniques Keil, Markus Adam, W Berdermann, E Bergonzo, P de Boer, Wim Bogani, F Borchi, E Brambilla, A Bruzzi, Mara Colledani, C Conway, J D'Angelo, P Dabrowski, W Delpierre, P A Dulinski, W New results on diamond pixel sensors using ATLAS frontend electronics |
title | New results on diamond pixel sensors using ATLAS frontend electronics |
title_full | New results on diamond pixel sensors using ATLAS frontend electronics |
title_fullStr | New results on diamond pixel sensors using ATLAS frontend electronics |
title_full_unstemmed | New results on diamond pixel sensors using ATLAS frontend electronics |
title_short | New results on diamond pixel sensors using ATLAS frontend electronics |
title_sort | new results on diamond pixel sensors using atlas frontend electronics |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1016/S0168-9002(02)02025-9 http://cds.cern.ch/record/624600 |
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