The Thermal and Mechanical Properties of Glues for the ATLAS SCT ModuleAssembly

We perform measurements of $C_{kt}-$the coefficient of thermal conductivityof two types of glue proposed for using in mechanical structureof the SCT modules of ATLAS .We compare the thermal property of thecommonly used electronic industry applications glue familyARALDITE and $Si-organic$ glue ``ELAS...

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Detalles Bibliográficos
Autores principales: Kholodenko, A G, Moser, H G, Riadovikov, VN
Lenguaje:eng
Publicado: 2000
Materias:
Detectors and Experimental Techniques
Acceso en línea:http://cds.cern.ch/record/684013
Descripción
Sumario:We perform measurements of $C_{kt}-$the coefficient of thermal conductivityof two types of glue proposed for using in mechanical structureof the SCT modules of ATLAS .We compare the thermal property of thecommonly used electronic industry applications glue familyARALDITE and $Si-organic$ glue ``ELASTOSIL 137-182'' .The coefficients of the thermal conductivity for Boron nitride filled ARALDITE 1102 and ELASTOSIL 137-182 are presented. The value of the strength at tension was tested. The main results of the our tests are in agreement withvalues specified by manufacturer.

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