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The Thermal and Mechanical Properties of Glues for the ATLAS SCT ModuleAssembly
We perform measurements of $C_{kt}-$the coefficient of thermal conductivityof two types of glue proposed for using in mechanical structureof the SCT modules of ATLAS .We compare the thermal property of thecommonly used electronic industry applications glue familyARALDITE and $Si-organic$ glue ``ELAS...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
2000
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/684013 |