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Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology

Silicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spac...

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Autor principal: Zamiatin, N
Lenguaje:eng
Publicado: 2000
Materias:
Acceso en línea:http://cds.cern.ch/record/687288
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author Zamiatin, N
author_facet Zamiatin, N
author_sort Zamiatin, N
collection CERN
description Silicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spacing of guardrings. We have in addition investigated the effects related tothe ohmic side processing andfound that the breakdown voltage depends strongly on the thickness of the effective “dead” n+ layer. Byincreasing this thicknessfrom 1Pm to2.5 Pm, thefraction of sensors with breakdown voltagehigher than 500V increasedfrom22% to more than 80%. In addition a thick n+ layer protects against defects caused by the technological treatment during detector production and assembly.
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institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2000
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spelling cern-6872882019-09-30T06:29:59Zhttp://cds.cern.ch/record/687288engZamiatin, NInvestigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing TechnologyDetectors and Experimental TechniquesSilicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spacing of guardrings. We have in addition investigated the effects related tothe ohmic side processing andfound that the breakdown voltage depends strongly on the thickness of the effective “dead” n+ layer. Byincreasing this thicknessfrom 1Pm to2.5 Pm, thefraction of sensors with breakdown voltagehigher than 500V increasedfrom22% to more than 80%. In addition a thick n+ layer protects against defects caused by the technological treatment during detector production and assembly.CMS-CR-2000-014oai:cds.cern.ch:6872882000-10-31
spellingShingle Detectors and Experimental Techniques
Zamiatin, N
Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title_full Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title_fullStr Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title_full_unstemmed Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title_short Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
title_sort investigation of silicon sensor quality as a function of the ohmic side processing technology
topic Detectors and Experimental Techniques
url http://cds.cern.ch/record/687288
work_keys_str_mv AT zamiatinn investigationofsiliconsensorqualityasafunctionoftheohmicsideprocessingtechnology