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Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology
Silicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spac...
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Lenguaje: | eng |
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2000
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Acceso en línea: | http://cds.cern.ch/record/687288 |
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author | Zamiatin, N |
author_facet | Zamiatin, N |
author_sort | Zamiatin, N |
collection | CERN |
description | Silicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spacing of guardrings. We have in addition investigated the effects related tothe ohmic side processing andfound that the breakdown voltage depends strongly on the thickness of the effective “dead” n+ layer. Byincreasing this thicknessfrom 1Pm to2.5 Pm, thefraction of sensors with breakdown voltagehigher than 500V increasedfrom22% to more than 80%. In addition a thick n+ layer protects against defects caused by the technological treatment during detector production and assembly. |
id | cern-687288 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2000 |
record_format | invenio |
spelling | cern-6872882019-09-30T06:29:59Zhttp://cds.cern.ch/record/687288engZamiatin, NInvestigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing TechnologyDetectors and Experimental TechniquesSilicon sensors designed for the CMS Preshower detector must have a high breakdown voltage in order to be fully efficient after strong irradiation. Studies madeby several groups [1-7] have underlined the importance of the p+ side geometrical parameters, such as the metalwidth and the number and spacing of guardrings. We have in addition investigated the effects related tothe ohmic side processing andfound that the breakdown voltage depends strongly on the thickness of the effective “dead” n+ layer. Byincreasing this thicknessfrom 1Pm to2.5 Pm, thefraction of sensors with breakdown voltagehigher than 500V increasedfrom22% to more than 80%. In addition a thick n+ layer protects against defects caused by the technological treatment during detector production and assembly.CMS-CR-2000-014oai:cds.cern.ch:6872882000-10-31 |
spellingShingle | Detectors and Experimental Techniques Zamiatin, N Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title | Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title_full | Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title_fullStr | Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title_full_unstemmed | Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title_short | Investigation of Silicon Sensor Quality as a Function of the Ohmic Side Processing Technology |
title_sort | investigation of silicon sensor quality as a function of the ohmic side processing technology |
topic | Detectors and Experimental Techniques |
url | http://cds.cern.ch/record/687288 |
work_keys_str_mv | AT zamiatinn investigationofsiliconsensorqualityasafunctionoftheohmicsideprocessingtechnology |