Front-End electronics and integration of ATLAS pixel modules

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge a...

Descripción completa

Detalles Bibliográficos
Autor principal: Hugging, Fabian
Lenguaje:eng
Publicado: 2004
Materias:
Other Fields of Physics
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2005.04.045
http://cds.cern.ch/record/707271
_version_ 1780902480946659328
author Hugging, Fabian
author_facet Hugging, Fabian
author_sort Hugging, Fabian
collection CERN
description For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.
id cern-707271
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2004
record_format invenio
spelling cern-7072712023-03-14T19:12:19Zdoi:10.1016/j.nima.2005.04.045http://cds.cern.ch/record/707271engHugging, FabianFront-End electronics and integration of ATLAS pixel modulesOther Fields of PhysicsFor the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.physics/0401106oai:cds.cern.ch:7072712004-01-21
spellingShingle Other Fields of Physics
Hugging, Fabian
Front-End electronics and integration of ATLAS pixel modules
title Front-End electronics and integration of ATLAS pixel modules
title_full Front-End electronics and integration of ATLAS pixel modules
title_fullStr Front-End electronics and integration of ATLAS pixel modules
title_full_unstemmed Front-End electronics and integration of ATLAS pixel modules
title_short Front-End electronics and integration of ATLAS pixel modules
title_sort front-end electronics and integration of atlas pixel modules
topic Other Fields of Physics
url https://dx.doi.org/10.1016/j.nima.2005.04.045
http://cds.cern.ch/record/707271
work_keys_str_mv AT huggingfabian frontendelectronicsandintegrationofatlaspixelmodules

Ejemplares similares