CERN slashes costs of making blind and buried vias in multi-layer PCBs

"A cheap technique for making blind and buried vias in multi-layer PCBs has been developed by scientists at CERN, Europe's particle physics research lab" (1/2 page)

Detalles Bibliográficos
Autor principal: Ball, R
Lenguaje:eng
Publicado: 2004
Materias:
Spinoffs
Acceso en línea:http://cds.cern.ch/record/720743
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author Ball, R
author_facet Ball, R
author_sort Ball, R
collection CERN
description "A cheap technique for making blind and buried vias in multi-layer PCBs has been developed by scientists at CERN, Europe's particle physics research lab" (1/2 page)
id cern-720743
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2004
record_format invenio
spelling cern-7207432019-09-30T06:29:59Zhttp://cds.cern.ch/record/720743engBall, RCERN slashes costs of making blind and buried vias in multi-layer PCBsSpinoffs"A cheap technique for making blind and buried vias in multi-layer PCBs has been developed by scientists at CERN, Europe's particle physics research lab" (1/2 page)PRESSCUT-2004-057oai:cds.cern.ch:7207432004
spellingShingle Spinoffs
Ball, R
CERN slashes costs of making blind and buried vias in multi-layer PCBs
title CERN slashes costs of making blind and buried vias in multi-layer PCBs
title_full CERN slashes costs of making blind and buried vias in multi-layer PCBs
title_fullStr CERN slashes costs of making blind and buried vias in multi-layer PCBs
title_full_unstemmed CERN slashes costs of making blind and buried vias in multi-layer PCBs
title_short CERN slashes costs of making blind and buried vias in multi-layer PCBs
title_sort cern slashes costs of making blind and buried vias in multi-layer pcbs
topic Spinoffs
url http://cds.cern.ch/record/720743
work_keys_str_mv AT ballr cernslashescostsofmakingblindandburiedviasinmultilayerpcbs

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