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CERN slashes costs of making blind and buried vias in multi-layer PCBs
"A cheap technique for making blind and buried vias in multi-layer PCBs has been developed by scientists at CERN, Europe's particle physics research lab" (1/2 page)
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| Lenguaje: | eng |
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2004
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| Acceso en línea: | http://cds.cern.ch/record/720743 |