Cargando…

Study of Bump Bonding Technology

Detalles Bibliográficos
Autores principales:	Cihangir, S, Andresen, J, Appel, J A, Cardoso, G, Christian, D C, Kendziora, C, Kwan, S, Marinelli, M, Ruschman, M K, Turqueti, M, Wong, M L, Zimmermann, S
Lenguaje:	eng
Publicado:	CERN 2003
Materias:	Detectors and Experimental Techniques
Acceso en línea:	https://dx.doi.org/10.5170/CERN-2003-006.302 http://cds.cern.ch/record/722071

Ejemplares similares

A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
por: Cihangir, S, et al.
Publicado: (2001)

Bump bonding for ATLAS
por: Gilchriese, M G D
Publicado: (1998)

Pixel Multichip Module for the BTeV Experiment at Fermilab
por: Cardoso, Guilherme, et al.
Publicado: (2004)

Low-cost bump bonding activities at CERN
por: Vahanen, S, et al.
Publicado: (2010)

The first bump-bonded pixel detectors on CVD diamond
por: Adam, W, et al.
Publicado: (1999)

ATLAS pixel detector bump bonding stress analysis
por: Olcese, M, et al.
Publicado: (1998)

Bump bonded pixel detectors on CVD diamond from RD42
por: Adam, W, et al.
Publicado: (1998)

Low-cost bump-bonding processes for high energy physics pixel detectors
por: Caselle, Michele, et al.
Publicado: (2015)

Study of indium bumps for the ATLAS pixel detector
por: Gemme, C, et al.
Publicado: (2001)

A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector
por: Campbell, M
Publicado: (2006)

A Test Stand System for High-Energy Physics Applications
por: Cardoso, Guilherme, et al.
Publicado: (2007)

A modulated fast bump for the CPS continuous transfer
por: Fiander, D C, et al.
Publicado: (1977)

Fine-pitch wafer bumping and assembly for high density detector systems
por: Huffman, A, et al.
Publicado: (2004)

Refrigerated hydrogen gas jet for the Fermilab antiproton accumulator
por: Allspach, D H, et al.
Publicado: (1996)

Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment
por: Delsante, M L, et al.
Publicado: (2004)

Pixel Multichip Module Development at Fermilab
por: Turqueti, Marcos, et al.
Publicado: (2005)

Fiber optic based readout for BTeV's pixel detector
por: Cancelo, G I E, et al.
Publicado: (2000)

The Pixel Tracking Telescope at the Fermilab Test Beam Facility
por: Kwan, Simon, et al.
Publicado: (2016)

FPIX1: An Advanced pixel readout chip
por: Mekkaoui, A, et al.
Publicado: (1999)

Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI
por: Brönnimann, C, et al.
Publicado: (2005)

Transient current technique for charged traps detection in silicon bonded interfaces
por: Bronuzzi, J, et al.
Publicado: (2019)

TAB Bonded SSD Module for the STAR and ALICE Trackers
por: Lutz, Jean Robert, et al.
Publicado: (1999)

Measurements with Si and GaAs pixel detectors bonded to photon counting readout chips
por: Schwarz, C, et al.
Publicado: (2001)

Diamond detector technology, status and perspectives
por: Kagan, H, et al.
Publicado: (2019)

AMS silicon tracker bonding scheme
por: Ghete, V M
Publicado: (1996)

VELO Module Production - Back End Bonding
por: Whitley, M, et al.
Publicado: (2007)

VELO Module Production - Front End Bonding
por: Whitley, M, et al.
Publicado: (2007)

VELO Module Production - Sensor End Bonding
por: Wormald, M, et al.
Publicado: (2007)

Bond and electron beam welding quality control of the aluminum stabilized and reinforced CMS conductor by means of ultrasonic phased-array technology
por: Neuenschwander, J, et al.
Publicado: (2002)

Resonant bond wire vibrations in the ATLAS semiconductor tracker
por: Barber, T J, et al.
Publicado: (2005)

Screen printing and chip flipping techniques for large area hybrid pixel bonding
por: Bonvicini, V, et al.
Publicado: (1995)

Diamond Detector Technology: Status and Perspectives
por: Reichmann, M, et al.
Publicado: (2018)

Diamond detector technology: status and perspectives
por: Kagan, Harris, et al.
Publicado: (2017)

A new high-resolution TOF technology
por: Fonte, Paulo J R, et al.
Publicado: (1999)

Technology of photocathode production
por: Braem, André, et al.
Publicado: (2003)

Advanced Solid State Detector Technologies for Particle Detection
por: Moraes, Danielle, et al.
Publicado: (2004)

Deep submicron CMOS technologies for the LHC experiments
por: Jarron, Pierre, et al.
Publicado: (1999)

Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method
por: Saitô, Y, et al.
Publicado: (1993)

Technology development of p-type microstrip detectors with radiation hard p-spray isolation
por: Pellegrini, G, et al.
Publicado: (2006)

SEM picture of bump bonding pads on ALICE readout chip
Publicado: (2002)

Cannot write session to /tmp/vufind_sessions/sess_0n1g5vub2pthgs1a0fdr08v3be