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Sensor development for the CMS pixel detector

The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh r...

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Detalles Bibliográficos
Autores principales: Bölla, G, Bortoletto, D, Horisberger, R P, Kaufmann, R, Rohe, T, Roy, A
Lenguaje:eng
Publicado: 2002
Materias:
Acceso en línea:https://dx.doi.org/10.1016/S0168-9002(02)00537-5
http://cds.cern.ch/record/774255
Descripción
Sumario:The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6x10 sup 1 sup 4 n sub e sub q /cm sup 2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an ''n in n'' concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixels has been implemented by the openings in the p-stop implants surrounding every pixel cell. A prototype of such sensors has been produced by two different companies and especially the properties of these resistors have extensively been tested before and after irradiation.