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Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector

The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, resp...

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Detalles Bibliográficos
Autores principales: Caselle, M, Anelli, G, Antinori, F, Burns, M, Campbell, M, Chochula, P, Dinapoli, R, Elia, D, Formenti, F, Fini, R A, Ghidini, B, Kluge, A, Lenti, V, Manzari, V, Meddi, F, Morel, M, Navach, F, Nilsson, P, Pepato, Adriano, Riedler, P, Santoro, R, Stefanini, G, Viesti, G, Wyllie, K
Lenguaje:eng
Publicado: 2004
Materias:
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2003.11.004
http://cds.cern.ch/record/802355
Descripción
Sumario:The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, respectively. Low-mass solutions are implemented for the bus and the mechanical support. In this contribution, we describe the basic module (half-stave) of the two SPD layers and we give an overview of its assembly procedure.