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Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector
The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, resp...
Autores principales: | , , , , , , , , , , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2004
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2003.11.004 http://cds.cern.ch/record/802355 |
_version_ | 1780904771521085440 |
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author | Caselle, M Anelli, G Antinori, F Burns, M Campbell, M Chochula, P Dinapoli, R Elia, D Formenti, F Fini, R A Ghidini, B Kluge, A Lenti, V Manzari, V Meddi, F Morel, M Navach, F Nilsson, P Pepato, Adriano Riedler, P Santoro, R Stefanini, G Viesti, G Wyllie, K |
author_facet | Caselle, M Anelli, G Antinori, F Burns, M Campbell, M Chochula, P Dinapoli, R Elia, D Formenti, F Fini, R A Ghidini, B Kluge, A Lenti, V Manzari, V Meddi, F Morel, M Navach, F Nilsson, P Pepato, Adriano Riedler, P Santoro, R Stefanini, G Viesti, G Wyllie, K |
author_sort | Caselle, M |
collection | CERN |
description | The Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, respectively. Low-mass solutions are implemented for the bus and the mechanical support. In this contribution, we describe the basic module (half-stave) of the two SPD layers and we give an overview of its assembly procedure. |
id | cern-802355 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2004 |
record_format | invenio |
spelling | cern-8023552019-09-30T06:29:59Zdoi:10.1016/j.nima.2003.11.004http://cds.cern.ch/record/802355engCaselle, MAnelli, GAntinori, FBurns, MCampbell, MChochula, PDinapoli, RElia, DFormenti, FFini, R AGhidini, BKluge, ALenti, VManzari, VMeddi, FMorel, MNavach, FNilsson, PPepato, AdrianoRiedler, PSantoro, RStefanini, GViesti, GWyllie, KAssembly procedure of the module (half-stave) of the ALICE Silicon Pixel DetectorDetectors and Experimental TechniquesThe Silicon Pixel Detector (SPD) forms the two innermost layers of the ALICE Inner Tracking System (ITS). The detector includes 1200 readout ASICs, each containing 8192 pixel cells, bump-bonded to Si sensor elements. The thickness of the readout chip and the sensor element is 150mum and 200mum, respectively. Low-mass solutions are implemented for the bus and the mechanical support. In this contribution, we describe the basic module (half-stave) of the two SPD layers and we give an overview of its assembly procedure.oai:cds.cern.ch:8023552004 |
spellingShingle | Detectors and Experimental Techniques Caselle, M Anelli, G Antinori, F Burns, M Campbell, M Chochula, P Dinapoli, R Elia, D Formenti, F Fini, R A Ghidini, B Kluge, A Lenti, V Manzari, V Meddi, F Morel, M Navach, F Nilsson, P Pepato, Adriano Riedler, P Santoro, R Stefanini, G Viesti, G Wyllie, K Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title | Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title_full | Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title_fullStr | Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title_full_unstemmed | Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title_short | Assembly procedure of the module (half-stave) of the ALICE Silicon Pixel Detector |
title_sort | assembly procedure of the module (half-stave) of the alice silicon pixel detector |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1016/j.nima.2003.11.004 http://cds.cern.ch/record/802355 |
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