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Probing and irradiation tests of ALICE pixel chip wafers and sensors

In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors...

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Detalles Bibliográficos
Autores principales: Cinausero, M, Fioretto, E, Antinori, F, Chochula, P, Dinapoli, R, Dima, R, Fabris, D, Galet, G, Lunardon, M, Manea, C, Marchini, S, Martini, S, Moretto, S, Pepato, Adriano, Prete, G, Riedler, P, Scarlassara, F, Segato, G F, Soramel, F, Stefanini, G, Turrisi, R, Vannucci, L, Viesti, G
Lenguaje:eng
Publicado: 2004
Materias:
Acceso en línea:http://cds.cern.ch/record/816713
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author Cinausero, M
Fioretto, E
Antinori, F
Chochula, P
Dinapoli, R
Dima, R
Fabris, D
Galet, G
Lunardon, M
Manea, C
Marchini, S
Martini, S
Moretto, S
Pepato, Adriano
Prete, G
Riedler, P
Scarlassara, F
Segato, G F
Soramel, F
Stefanini, G
Turrisi, R
Vannucci, L
Viesti, G
author_facet Cinausero, M
Fioretto, E
Antinori, F
Chochula, P
Dinapoli, R
Dima, R
Fabris, D
Galet, G
Lunardon, M
Manea, C
Marchini, S
Martini, S
Moretto, S
Pepato, Adriano
Prete, G
Riedler, P
Scarlassara, F
Segato, G F
Soramel, F
Stefanini, G
Turrisi, R
Vannucci, L
Viesti, G
author_sort Cinausero, M
collection CERN
description In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. In this paper we describe the wafer probing and irradiation set-ups and we report the obtained results. (6 refs).
id cern-816713
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2004
record_format invenio
spelling cern-8167132019-09-30T06:29:59Zhttp://cds.cern.ch/record/816713engCinausero, MFioretto, EAntinori, FChochula, PDinapoli, RDima, RFabris, DGalet, GLunardon, MManea, CMarchini, SMartini, SMoretto, SPepato, AdrianoPrete, GRiedler, PScarlassara, FSegato, G FSoramel, FStefanini, GTurrisi, RVannucci, LViesti, GProbing and irradiation tests of ALICE pixel chip wafers and sensorsDetectors and Experimental TechniquesIn the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. In this paper we describe the wafer probing and irradiation set-ups and we report the obtained results. (6 refs).oai:cds.cern.ch:8167132004
spellingShingle Detectors and Experimental Techniques
Cinausero, M
Fioretto, E
Antinori, F
Chochula, P
Dinapoli, R
Dima, R
Fabris, D
Galet, G
Lunardon, M
Manea, C
Marchini, S
Martini, S
Moretto, S
Pepato, Adriano
Prete, G
Riedler, P
Scarlassara, F
Segato, G F
Soramel, F
Stefanini, G
Turrisi, R
Vannucci, L
Viesti, G
Probing and irradiation tests of ALICE pixel chip wafers and sensors
title Probing and irradiation tests of ALICE pixel chip wafers and sensors
title_full Probing and irradiation tests of ALICE pixel chip wafers and sensors
title_fullStr Probing and irradiation tests of ALICE pixel chip wafers and sensors
title_full_unstemmed Probing and irradiation tests of ALICE pixel chip wafers and sensors
title_short Probing and irradiation tests of ALICE pixel chip wafers and sensors
title_sort probing and irradiation tests of alice pixel chip wafers and sensors
topic Detectors and Experimental Techniques
url http://cds.cern.ch/record/816713
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