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Probing and irradiation tests of ALICE pixel chip wafers and sensors
In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors...
Autores principales: | , , , , , , , , , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2004
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/816713 |
_version_ | 1780905428475969536 |
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author | Cinausero, M Fioretto, E Antinori, F Chochula, P Dinapoli, R Dima, R Fabris, D Galet, G Lunardon, M Manea, C Marchini, S Martini, S Moretto, S Pepato, Adriano Prete, G Riedler, P Scarlassara, F Segato, G F Soramel, F Stefanini, G Turrisi, R Vannucci, L Viesti, G |
author_facet | Cinausero, M Fioretto, E Antinori, F Chochula, P Dinapoli, R Dima, R Fabris, D Galet, G Lunardon, M Manea, C Marchini, S Martini, S Moretto, S Pepato, Adriano Prete, G Riedler, P Scarlassara, F Segato, G F Soramel, F Stefanini, G Turrisi, R Vannucci, L Viesti, G |
author_sort | Cinausero, M |
collection | CERN |
description | In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. In this paper we describe the wafer probing and irradiation set-ups and we report the obtained results. (6 refs). |
id | cern-816713 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2004 |
record_format | invenio |
spelling | cern-8167132019-09-30T06:29:59Zhttp://cds.cern.ch/record/816713engCinausero, MFioretto, EAntinori, FChochula, PDinapoli, RDima, RFabris, DGalet, GLunardon, MManea, CMarchini, SMartini, SMoretto, SPepato, AdrianoPrete, GRiedler, PScarlassara, FSegato, G FSoramel, FStefanini, GTurrisi, RVannucci, LViesti, GProbing and irradiation tests of ALICE pixel chip wafers and sensorsDetectors and Experimental TechniquesIn the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors have been carried out using the 27 MeV proton beam delivered by the XTU TANDEM accelerator at the SIRAD facility in LNL. In this paper we describe the wafer probing and irradiation set-ups and we report the obtained results. (6 refs).oai:cds.cern.ch:8167132004 |
spellingShingle | Detectors and Experimental Techniques Cinausero, M Fioretto, E Antinori, F Chochula, P Dinapoli, R Dima, R Fabris, D Galet, G Lunardon, M Manea, C Marchini, S Martini, S Moretto, S Pepato, Adriano Prete, G Riedler, P Scarlassara, F Segato, G F Soramel, F Stefanini, G Turrisi, R Vannucci, L Viesti, G Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title | Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title_full | Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title_fullStr | Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title_full_unstemmed | Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title_short | Probing and irradiation tests of ALICE pixel chip wafers and sensors |
title_sort | probing and irradiation tests of alice pixel chip wafers and sensors |
topic | Detectors and Experimental Techniques |
url | http://cds.cern.ch/record/816713 |
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