Probing and irradiation tests of ALICE pixel chip wafers and sensors

In the framework of the ALICE Silicon Pixel Detector (SPD) project a system dedicated to the tests of the ALICE1LHCb chip wafers has been assembled and is now in use for the selection of pixel chips to be bump-bonded to sensor ladders. In parallel, radiation hardness tests of the SPD silicon sensors...

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Detalles Bibliográficos
Autores principales: Cinausero, M, Fioretto, E, Antinori, F, Chochula, P, Dinapoli, R, Dima, R, Fabris, D, Galet, G, Lunardon, M, Manea, C, Marchini, S, Martini, S, Moretto, S, Pepato, Adriano, Prete, G, Riedler, P, Scarlassara, F, Segato, G F, Soramel, F, Stefanini, G, Turrisi, R, Vannucci, L, Viesti, G
Lenguaje:eng
Publicado: 2004
Materias:
Detectors and Experimental Techniques
Acceso en línea:http://cds.cern.ch/record/816713

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