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The electronics hybrid of the ATLAS-SCT endcap detector modules
An electronics hybrid has been developed for the ATLAS silicon microstrip tracker endcaps. The high-density interconnect board carries 12 readout ASICs, as well as ASICs for the optical data transmission. Special requirements are that this hybrid has to be double sided, radiation hard, and low mass....
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Lenguaje: | eng |
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2004
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Acceso en línea: | https://dx.doi.org/10.1109/TNS.2004.829547 http://cds.cern.ch/record/816763 |
_version_ | 1780905434603847680 |
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author | Ketterer, C |
author_facet | Ketterer, C |
author_sort | Ketterer, C |
collection | CERN |
description | An electronics hybrid has been developed for the ATLAS silicon microstrip tracker endcaps. The high-density interconnect board carries 12 readout ASICs, as well as ASICs for the optical data transmission. Special requirements are that this hybrid has to be double sided, radiation hard, and low mass. A six-layer flexible circuit in copper-polyimide technology has been chosen for this purpose. It is folded around a highly heat conducting carbon-carbon composite substrate to form the rigid double-sided hybrid. Adequate thermal, mechanical, and electrical performance of the hybrid has been demonstrated. The production of the hybrids started in May 2003. (12 refs). |
id | cern-816763 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2004 |
record_format | invenio |
spelling | cern-8167632019-09-30T06:29:59Zdoi:10.1109/TNS.2004.829547http://cds.cern.ch/record/816763engKetterer, CThe electronics hybrid of the ATLAS-SCT endcap detector modulesDetectors and Experimental TechniquesAn electronics hybrid has been developed for the ATLAS silicon microstrip tracker endcaps. The high-density interconnect board carries 12 readout ASICs, as well as ASICs for the optical data transmission. Special requirements are that this hybrid has to be double sided, radiation hard, and low mass. A six-layer flexible circuit in copper-polyimide technology has been chosen for this purpose. It is folded around a highly heat conducting carbon-carbon composite substrate to form the rigid double-sided hybrid. Adequate thermal, mechanical, and electrical performance of the hybrid has been demonstrated. The production of the hybrids started in May 2003. (12 refs).oai:cds.cern.ch:8167632004 |
spellingShingle | Detectors and Experimental Techniques Ketterer, C The electronics hybrid of the ATLAS-SCT endcap detector modules |
title | The electronics hybrid of the ATLAS-SCT endcap detector modules |
title_full | The electronics hybrid of the ATLAS-SCT endcap detector modules |
title_fullStr | The electronics hybrid of the ATLAS-SCT endcap detector modules |
title_full_unstemmed | The electronics hybrid of the ATLAS-SCT endcap detector modules |
title_short | The electronics hybrid of the ATLAS-SCT endcap detector modules |
title_sort | electronics hybrid of the atlas-sct endcap detector modules |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1109/TNS.2004.829547 http://cds.cern.ch/record/816763 |
work_keys_str_mv | AT kettererc theelectronicshybridoftheatlassctendcapdetectormodules AT kettererc electronicshybridoftheatlassctendcapdetectormodules |