Cargando…
Fine-pitch wafer bumping and assembly for high density detector systems
A number of high energy physics experiments will rely on pixilated detector arrays to track particles generated in a collision event. In addition, several medical imaging applications are using pixilated devices as the imaging elements. The pixels in these detectors are very small (50-100 mu m pitch...
Autores principales: | Huffman, A, Bonafede, S, La Bennett, R, Statler, C |
---|---|
Lenguaje: | eng |
Publicado: |
2004
|
Materias: | |
Acceso en línea: | http://cds.cern.ch/record/908916 |
Ejemplares similares
-
A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector
por: Campbell, M
Publicado: (2006) -
Fine Pitch GEMs in Triple GEM detectors
por: Brask, August
Publicado: (2023) -
Study of indium bumps for the ATLAS pixel detector
por: Gemme, C, et al.
Publicado: (2001) -
ATLAS pixel detector bump bonding stress analysis
por: Olcese, M, et al.
Publicado: (1998) -
The first bump-bonded pixel detectors on CVD diamond
por: Adam, W, et al.
Publicado: (1999)