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In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).

2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chi...

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Detalles Bibliográficos
Autor principal: Saba, A
Publicado: 2006
Materias:
ITS
Acceso en línea:http://cds.cern.ch/record/975469
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author Saba, A
author_facet Saba, A
author_sort Saba, A
collection CERN
description 2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
id cern-975469
institution Organización Europea para la Investigación Nuclear
publishDate 2006
record_format invenio
spelling cern-9754692019-09-30T06:29:59Zhttp://cds.cern.ch/record/975469Saba, AIn the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).ITS2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).ALICE-PICT-ITS-2006-004oai:cds.cern.ch:9754692006-04-10
spellingShingle ITS
Saba, A
In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title_full In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title_fullStr In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title_full_unstemmed In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title_short In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
title_sort in the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
topic ITS
url http://cds.cern.ch/record/975469
work_keys_str_mv AT sabaa inthephotographonecanseetheinterconnectionfromonereadoutchiptotheflexiblecablerealizedwithultrasonicwirebonds25microns