Cargando…
In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chi...
| Autor principal: | |
|---|---|
| Publicado: |
2006
|
| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/975469 |
| _version_ | 1780910919034863616 |
|---|---|
| author | Saba, A |
| author_facet | Saba, A |
| author_sort | Saba, A |
| collection | CERN |
| description | 2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| id | cern-975469 |
| institution | Organización Europea para la Investigación Nuclear |
| publishDate | 2006 |
| record_format | invenio |
| spelling | cern-9754692019-09-30T06:29:59Zhttp://cds.cern.ch/record/975469Saba, AIn the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).ITS2 ladders are connected via a multi layer aluminium polyimide flexible cable with a multi chip module containing several custom designed ASICs. The production of the flexible cable was developed and carrier out at CERN. It provides signal and data lines as well as power to the individual readout chipswith a total thickness of only 220 microns. In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).ALICE-PICT-ITS-2006-004oai:cds.cern.ch:9754692006-04-10 |
| spellingShingle | ITS Saba, A In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title | In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title_full | In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title_fullStr | In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title_full_unstemmed | In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title_short | In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| title_sort | in the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns). |
| topic | ITS |
| url | http://cds.cern.ch/record/975469 |
| work_keys_str_mv | AT sabaa inthephotographonecanseetheinterconnectionfromonereadoutchiptotheflexiblecablerealizedwithultrasonicwirebonds25microns |