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Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
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| Publicado: |
2006
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| Acceso en línea: | http://cds.cern.ch/record/975471 |
| Sumario: | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
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