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Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
Autor principal: | |
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Publicado: |
2006
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/975471 |
_version_ | 1780910919473168384 |
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author | Saba, A |
author_facet | Saba, A |
author_sort | Saba, A |
collection | CERN |
description | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
id | cern-975471 |
institution | Organización Europea para la Investigación Nuclear |
publishDate | 2006 |
record_format | invenio |
spelling | cern-9754712019-09-30T06:29:59Zhttp://cds.cern.ch/record/975471Saba, AWire bonding of the MCM multi chip module using 25 micron wire at CERN.ITSWire bonding of the MCM multi chip module using 25 micron wire at CERN.ALICE-PICT-ITS-2006-006oai:cds.cern.ch:9754712006-04-10 |
spellingShingle | ITS Saba, A Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title_full | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title_fullStr | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title_full_unstemmed | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title_short | Wire bonding of the MCM multi chip module using 25 micron wire at CERN. |
title_sort | wire bonding of the mcm multi chip module using 25 micron wire at cern. |
topic | ITS |
url | http://cds.cern.ch/record/975471 |
work_keys_str_mv | AT sabaa wirebondingofthemcmmultichipmoduleusing25micronwireatcern |