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Wire bonding of the MCM multi chip module using 25 micron wire at CERN.

Wire bonding of the MCM multi chip module using 25 micron wire at CERN.

Detalles Bibliográficos
Autor principal: Saba, A
Publicado: 2006
Materias:
ITS
Acceso en línea:http://cds.cern.ch/record/975471
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author Saba, A
author_facet Saba, A
author_sort Saba, A
collection CERN
description Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
id cern-975471
institution Organización Europea para la Investigación Nuclear
publishDate 2006
record_format invenio
spelling cern-9754712019-09-30T06:29:59Zhttp://cds.cern.ch/record/975471Saba, AWire bonding of the MCM multi chip module using 25 micron wire at CERN.ITSWire bonding of the MCM multi chip module using 25 micron wire at CERN.ALICE-PICT-ITS-2006-006oai:cds.cern.ch:9754712006-04-10
spellingShingle ITS
Saba, A
Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title_full Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title_fullStr Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title_full_unstemmed Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title_short Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
title_sort wire bonding of the mcm multi chip module using 25 micron wire at cern.
topic ITS
url http://cds.cern.ch/record/975471
work_keys_str_mv AT sabaa wirebondingofthemcmmultichipmoduleusing25micronwireatcern