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Wire bonding of the MCM multi chip module using 25 micron wire at CERN.

Wire bonding of the MCM multi chip module using 25 micron wire at CERN.

Detalles Bibliográficos
Autor principal:	Saba, A
Publicado:	2006
Materias:	ITS
Acceso en línea:	http://cds.cern.ch/record/975471

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