Novel module production methods for the CMS pixel detector, upgrade phase I

For the High-Luminosity upgrade of the LHC (HL-LHC), phase I, the CMS pixel detector needs to be replaced. In order to improve the tracking resolution even at high luminosity the pixel detector is upgraded by a fourth barrel layer. This paper describes the production process and results for the fourth barrel layer for the CMS silicon pixel detector, upgrade phase I. The additional barrel layer will be produced by KIT and DESY. Both research centers have commonly developed and investigated new production processes, including SAC solder bump jetting, gold stud bumping and 'Precoat by Powder Processes' (PPS) to bump the sensor tiles and prepare them for the flip-chip process. First bare modules have been produced with the new digital ROC.