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Development of new 3D pixel sensors for phase 2 upgrades at LHC
We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors...
Autores principales: | , , , , , |
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Lenguaje: | eng |
Publicado: |
2016
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1109/NSSMIC.2015.7581946 http://cds.cern.ch/record/2239702 |
_version_ | 1780953039030452224 |
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author | Dalla Betta, Gian-Franco Boscardin, Maurizio Mendicino, Roberto Ronchin, Sabina Sultan, D.M.S. Zorzi, Nicola |
author_facet | Dalla Betta, Gian-Franco Boscardin, Maurizio Mendicino, Roberto Ronchin, Sabina Sultan, D.M.S. Zorzi, Nicola |
author_sort | Dalla Betta, Gian-Franco |
collection | CERN |
description | We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors (~100 um) with electrodes having narrower size (~ 5 um) and reduced spacing (~ 30 um) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6-inch wafers. |
id | oai-inspirehep.net-1501528 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2016 |
record_format | invenio |
spelling | oai-inspirehep.net-15015282021-05-03T20:13:49Zdoi:10.1109/NSSMIC.2015.7581946http://cds.cern.ch/record/2239702engDalla Betta, Gian-FrancoBoscardin, MaurizioMendicino, RobertoRonchin, SabinaSultan, D.M.S.Zorzi, NicolaDevelopment of new 3D pixel sensors for phase 2 upgrades at LHCphysics.ins-detDetectors and Experimental TechniquesWe report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors (~100 um) with electrodes having narrower size (~ 5 um) and reduced spacing (~ 30 um) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6-inch wafers.We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50×50 or 25×100 μm<sup>2</sup> pixel size) and extreme radiation hardness (up to a fluence of 2×10<sup>16</sup> n<sub>eq</sub> cm<sup>-2</sup>), thinner 3D sensors (~100 μm) with electrodes having narrower size (~ 5 μm) and reduced spacing (~ 30 μm) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6" wafers.arXiv:1612.00608oai:inspirehep.net:15015282016-12-02 |
spellingShingle | physics.ins-det Detectors and Experimental Techniques Dalla Betta, Gian-Franco Boscardin, Maurizio Mendicino, Roberto Ronchin, Sabina Sultan, D.M.S. Zorzi, Nicola Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title | Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title_full | Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title_fullStr | Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title_full_unstemmed | Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title_short | Development of new 3D pixel sensors for phase 2 upgrades at LHC |
title_sort | development of new 3d pixel sensors for phase 2 upgrades at lhc |
topic | physics.ins-det Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1109/NSSMIC.2015.7581946 http://cds.cern.ch/record/2239702 |
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