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Thermal stability of interface voids in Cu grain boundaries with molecular dynamic simulations
By means of molecular dynamic simulations, the stability of cylindrical voids is examined with respect to the diffusion bonding procedure. To do this, the effect of grain boundaries between the grains of different crystallographic orientations on the void closing time was studied at high temperature...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
2016
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1088/0022-3727/49/35/355303 http://cds.cern.ch/record/2268694 |