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First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors

The upgrade of the ATLAS [1] tracking detector for the High-Luminosity Large Hadron Collider (LHC) at CERN requires novel radiation hard silicon sensor technologies. Significant effort has been put into the development of monolithic CMOS sensors but it has been a challenge to combine a low capacitan...

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Autores principales: Pernegger, Heinz, Bates, R, Buttar, C, Dalla, M, Hoorne, J W van, Kugathasan, T, Maneuski, D, Musa, L, Riedler, P, Riegel, C, Sbarra, C, Schaefer, D, Schioppa, E J, Snoeys, W
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: JINST 2017
Materias:
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/12/06/P06008
http://cds.cern.ch/record/2274477
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author Pernegger, Heinz
Bates, R
Buttar, C
Dalla, M
Hoorne, J W van
Kugathasan, T
Maneuski, D
Musa, L
Riedler, P
Riegel, C
Sbarra, C
Schaefer, D
Schioppa, E J
Snoeys, W
author_facet Pernegger, Heinz
Bates, R
Buttar, C
Dalla, M
Hoorne, J W van
Kugathasan, T
Maneuski, D
Musa, L
Riedler, P
Riegel, C
Sbarra, C
Schaefer, D
Schioppa, E J
Snoeys, W
author_sort Pernegger, Heinz
collection CERN
description The upgrade of the ATLAS [1] tracking detector for the High-Luminosity Large Hadron Collider (LHC) at CERN requires novel radiation hard silicon sensor technologies. Significant effort has been put into the development of monolithic CMOS sensors but it has been a challenge to combine a low capacitance of the sensing node with full depletion of the sensitive layer. Low capacitance brings low analog power. Depletion of the sensitive layer causes the signal charge to be collected by drift sufficiently fast to separate hits from consecutive bunch crossings (25 ns at the LHC) and to avoid losing the charge by trapping. This paper focuses on the characterization of charge collection properties and detection efficiency of prototype sensors originally designed in the framework of the ALICE Inner Tracking System (ITS) upgrade [2]. The prototypes are fabricated both in the standard TowerJazz 180nm CMOS imager process [3] and in an innovative modification of this process developed in collaboration with the foundry, aimed to fully deplete the sensitive epitaxial layer and enhance the tolerance to non-ionizing energy loss. Sensors fabricated in standard and modified process variants were characterized using radioactive sources, focused X-ray beam and test beams before and after irradiation. Contrary to sensors manufactured in the standard process, sensors from the modified process remain fully functional even after a dose of 10(15)n(eq)/cm(2), which is the the expected NIEL radiation fluence for the outer pixel layers in the future ATLAS Inner Tracker (ITk) [4].
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spelling oai-inspirehep.net-16041062019-10-15T15:18:29Z doi:10.1088/1748-0221/12/06/P06008 http://cds.cern.ch/record/2274477 eng Pernegger, Heinz Bates, R Buttar, C Dalla, M Hoorne, J W van Kugathasan, T Maneuski, D Musa, L Riedler, P Riegel, C Sbarra, C Schaefer, D Schioppa, E J Snoeys, W First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors Detectors and Experimental Techniques 6: Novel high voltage and resistive CMOS sensors The upgrade of the ATLAS [1] tracking detector for the High-Luminosity Large Hadron Collider (LHC) at CERN requires novel radiation hard silicon sensor technologies. Significant effort has been put into the development of monolithic CMOS sensors but it has been a challenge to combine a low capacitance of the sensing node with full depletion of the sensitive layer. Low capacitance brings low analog power. Depletion of the sensitive layer causes the signal charge to be collected by drift sufficiently fast to separate hits from consecutive bunch crossings (25 ns at the LHC) and to avoid losing the charge by trapping. This paper focuses on the characterization of charge collection properties and detection efficiency of prototype sensors originally designed in the framework of the ALICE Inner Tracking System (ITS) upgrade [2]. The prototypes are fabricated both in the standard TowerJazz 180nm CMOS imager process [3] and in an innovative modification of this process developed in collaboration with the foundry, aimed to fully deplete the sensitive epitaxial layer and enhance the tolerance to non-ionizing energy loss. Sensors fabricated in standard and modified process variants were characterized using radioactive sources, focused X-ray beam and test beams before and after irradiation. Contrary to sensors manufactured in the standard process, sensors from the modified process remain fully functional even after a dose of 10(15)n(eq)/cm(2), which is the the expected NIEL radiation fluence for the outer pixel layers in the future ATLAS Inner Tracker (ITk) [4]. info:eu-repo/grantAgreement/EC/FP7/654168 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/2274477 JINST JINST, 06 (2017) pp. P06008 2017
spellingShingle Detectors and Experimental Techniques
6: Novel high voltage and resistive CMOS sensors
Pernegger, Heinz
Bates, R
Buttar, C
Dalla, M
Hoorne, J W van
Kugathasan, T
Maneuski, D
Musa, L
Riedler, P
Riegel, C
Sbarra, C
Schaefer, D
Schioppa, E J
Snoeys, W
First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title_full First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title_fullStr First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title_full_unstemmed First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title_short First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
title_sort first tests of a novel radiation hard cmos sensor process for depleted monolithic active pixel sensors
topic Detectors and Experimental Techniques
6: Novel high voltage and resistive CMOS sensors
url https://dx.doi.org/10.1088/1748-0221/12/06/P06008
http://cds.cern.ch/record/2274477
http://cds.cern.ch/record/2274477
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