Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade

Technological solutions for the transfer to large area microstrip radiation silicon sensors are presented for the upgrade of the ATLAS detector. A new Automatic Layout Generation Tool has been developed to easily adapt the design of the sensors, investigating also the fabrication processes involved...

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Detalles Bibliográficos
Autores principales: Fernández-Tejero, J, Ullán, M, Fleta, C, Quirion, D
Lenguaje:eng
Publicado: 2017
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1109/CDE.2017.7905242
http://cds.cern.ch/record/2306349
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author Fernández-Tejero, J
Ullán, M
Fleta, C
Quirion, D
author_facet Fernández-Tejero, J
Ullán, M
Fleta, C
Quirion, D
author_sort Fernández-Tejero, J
collection CERN
description Technological solutions for the transfer to large area microstrip radiation silicon sensors are presented for the upgrade of the ATLAS detector. A new Automatic Layout Generation Tool has been developed to easily adapt the design of the sensors, investigating also the fabrication processes involved in 6-inch wafer technology. Inter-strip and radiation hardness characterization of prototype sensors is presented, showing an agreement with the new specifications. Embedded Pitch Adaptor concept is studied as a solution for the sensor/readout interconnection for the forthcoming ATLAS Upgrade.
id oai-inspirehep.net-1639098
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2017
record_format invenio
spelling oai-inspirehep.net-16390982019-09-30T06:29:59Zdoi:10.1109/CDE.2017.7905242http://cds.cern.ch/record/2306349engFernández-Tejero, JUllán, MFleta, CQuirion, DTechnological solutions for large area microstrip radiation silicon sensors for the LHC UpgradeDetectors and Experimental TechniquesTechnological solutions for the transfer to large area microstrip radiation silicon sensors are presented for the upgrade of the ATLAS detector. A new Automatic Layout Generation Tool has been developed to easily adapt the design of the sensors, investigating also the fabrication processes involved in 6-inch wafer technology. Inter-strip and radiation hardness characterization of prototype sensors is presented, showing an agreement with the new specifications. Embedded Pitch Adaptor concept is studied as a solution for the sensor/readout interconnection for the forthcoming ATLAS Upgrade.oai:inspirehep.net:16390982017
spellingShingle Detectors and Experimental Techniques
Fernández-Tejero, J
Ullán, M
Fleta, C
Quirion, D
Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title_full Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title_fullStr Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title_full_unstemmed Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title_short Technological solutions for large area microstrip radiation silicon sensors for the LHC Upgrade
title_sort technological solutions for large area microstrip radiation silicon sensors for the lhc upgrade
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1109/CDE.2017.7905242
http://cds.cern.ch/record/2306349
work_keys_str_mv AT fernandeztejeroj technologicalsolutionsforlargeareamicrostripradiationsiliconsensorsforthelhcupgrade
AT ullanm technologicalsolutionsforlargeareamicrostripradiationsiliconsensorsforthelhcupgrade
AT fletac technologicalsolutionsforlargeareamicrostripradiationsiliconsensorsforthelhcupgrade
AT quiriond technologicalsolutionsforlargeareamicrostripradiationsiliconsensorsforthelhcupgrade

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