Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade

A quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the qua...

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Detalles Bibliográficos
Autores principales: Dunne, Katherine, Garcia-Sciveres, Maurice, Heim, Timon
Lenguaje:eng
Publicado: SISSA 2018
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.22323/1.313.0065
http://cds.cern.ch/record/2673655
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author Dunne, Katherine
Garcia-Sciveres, Maurice
Heim, Timon
author_facet Dunne, Katherine
Garcia-Sciveres, Maurice
Heim, Timon
author_sort Dunne, Katherine
collection CERN
description A quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the quad chip modules and system integration tests of modules installed on an I-beam. Experience from these hybrid assemblies will inform the design of a flex hybrid for the new large format readout chip, RD53A, which will be produced in 2017 by the RD53 collaboration.
id oai-inspirehep.net-1665027
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2018
publisher SISSA
record_format invenio
spelling oai-inspirehep.net-16650272021-05-03T07:55:01Zdoi:10.22323/1.313.0065http://cds.cern.ch/record/2673655engDunne, KatherineGarcia-Sciveres, MauriceHeim, TimonQuad Module Hybrid Development for the ATLAS Pixel Layer UpgradeDetectors and Experimental TechniquesA quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the quad chip modules and system integration tests of modules installed on an I-beam. Experience from these hybrid assemblies will inform the design of a flex hybrid for the new large format readout chip, RD53A, which will be produced in 2017 by the RD53 collaboration.SISSAoai:inspirehep.net:16650272018
spellingShingle Detectors and Experimental Techniques
Dunne, Katherine
Garcia-Sciveres, Maurice
Heim, Timon
Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title_full Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title_fullStr Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title_full_unstemmed Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title_short Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
title_sort quad module hybrid development for the atlas pixel layer upgrade
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.22323/1.313.0065
http://cds.cern.ch/record/2673655
work_keys_str_mv AT dunnekatherine quadmodulehybriddevelopmentfortheatlaspixellayerupgrade
AT garciasciveresmaurice quadmodulehybriddevelopmentfortheatlaspixellayerupgrade
AT heimtimon quadmodulehybriddevelopmentfortheatlaspixellayerupgrade

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