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Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
A quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the qua...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
SISSA
2018
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.22323/1.313.0065 http://cds.cern.ch/record/2673655 |