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Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer
Large area silicon pixel trackers are currently under development for the High Luminosity upgrade of the LHC detectors. They are also foreseen for the detectors proposed for the future high energy Compact Linear Collider CLIC. For the CLIC tracker a single hit resolution of 7μm, a timing resolution...
Autores principales: | , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
2019
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1016/j.nima.2019.02.049 http://cds.cern.ch/record/2686582 |
_version_ | 1780963608669192192 |
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author | Dannheim, Dominik Fiergolski, Adrian van Hoorne, Jacobus Hynds, Daniel Klempt, Wolfgang Kugathasan, Thanushan Munker, Magdalena Nürnberg, Andreas Sielewicz, Krzysztof Snoeys, Walter Spannagel, Simon |
author_facet | Dannheim, Dominik Fiergolski, Adrian van Hoorne, Jacobus Hynds, Daniel Klempt, Wolfgang Kugathasan, Thanushan Munker, Magdalena Nürnberg, Andreas Sielewicz, Krzysztof Snoeys, Walter Spannagel, Simon |
author_sort | Dannheim, Dominik |
collection | CERN |
description | Large area silicon pixel trackers are currently under development for the High Luminosity upgrade of the LHC detectors. They are also foreseen for the detectors proposed for the future high energy Compact Linear Collider CLIC. For the CLIC tracker a single hit resolution of 7μm, a timing resolution of a few nanoseconds and a material budget of 1–2% of radiation length per detection layer are required. Integrated CMOS technologies are promising candidates to reduce the cost, facilitate the production and to achieve a low material budget. CMOS sensors with a small size of the collection electrode benefit from a small sensor capacitance, resulting in a large signal to noise ratio and a low power consumption. The Investigator is a test-chip developed for the ALICE Inner Tracking System upgrade, implemented in a 180 nm CMOS process with a small collection electrode on a high resistivity epitaxial layer. The Investigator has been produced in different process variants: the standard process and a modified process, where an additional N-layer has been inserted to obtain full lateral depletion. This paper presents a comparison of test-beam results for both process variants, focuses on spatial and timing resolution as well as efficiency measurements. |
id | oai-inspirehep.net-1723486 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2019 |
record_format | invenio |
spelling | oai-inspirehep.net-17234862019-11-01T15:01:29Zdoi:10.1016/j.nima.2019.02.049http://cds.cern.ch/record/2686582engDannheim, DominikFiergolski, Adrianvan Hoorne, JacobusHynds, DanielKlempt, WolfgangKugathasan, ThanushanMunker, MagdalenaNürnberg, AndreasSielewicz, KrzysztofSnoeys, WalterSpannagel, SimonComparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layerDetectors and Experimental TechniquesLarge area silicon pixel trackers are currently under development for the High Luminosity upgrade of the LHC detectors. They are also foreseen for the detectors proposed for the future high energy Compact Linear Collider CLIC. For the CLIC tracker a single hit resolution of 7μm, a timing resolution of a few nanoseconds and a material budget of 1–2% of radiation length per detection layer are required. Integrated CMOS technologies are promising candidates to reduce the cost, facilitate the production and to achieve a low material budget. CMOS sensors with a small size of the collection electrode benefit from a small sensor capacitance, resulting in a large signal to noise ratio and a low power consumption. The Investigator is a test-chip developed for the ALICE Inner Tracking System upgrade, implemented in a 180 nm CMOS process with a small collection electrode on a high resistivity epitaxial layer. The Investigator has been produced in different process variants: the standard process and a modified process, where an additional N-layer has been inserted to obtain full lateral depletion. This paper presents a comparison of test-beam results for both process variants, focuses on spatial and timing resolution as well as efficiency measurements.oai:inspirehep.net:17234862019 |
spellingShingle | Detectors and Experimental Techniques Dannheim, Dominik Fiergolski, Adrian van Hoorne, Jacobus Hynds, Daniel Klempt, Wolfgang Kugathasan, Thanushan Munker, Magdalena Nürnberg, Andreas Sielewicz, Krzysztof Snoeys, Walter Spannagel, Simon Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title | Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title_full | Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title_fullStr | Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title_full_unstemmed | Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title_short | Comparison of small collection electrode CMOS pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
title_sort | comparison of small collection electrode cmos pixel sensors with partial and full lateral depletion of the high-resistivity epitaxial layer |
topic | Detectors and Experimental Techniques |
url | https://dx.doi.org/10.1016/j.nima.2019.02.049 http://cds.cern.ch/record/2686582 |
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