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Transient current technique for charged traps detection in silicon bonded interfaces
Wafer bonding is an established technology for the manufacturing of silicon-on-insulator (SOI) substrates, micro-electromechanical systems (MEMS) and microfluidic devices. Low temperature direct bonding techniques can be of particular interest for the fabrication of monolithic radiation sensors. Suc...
| Autores principales: | , , , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2019
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1063/1.5079999 http://cds.cern.ch/record/2665780 |