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Diffusion bonding of Cu atoms with molecular dynamics simulations
Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of press...
Autores principales: | , , |
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Lenguaje: | eng |
Publicado: |
2020
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Acceso en línea: | https://dx.doi.org/10.1016/j.rinp.2019.102890 http://cds.cern.ch/record/2730826 |