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Diffusion bonding of Cu atoms with molecular dynamics simulations

Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of press...

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Detalles Bibliográficos
Autores principales: Xydou, A, Parviainen, S, Djurabekova, F
Lenguaje:eng
Publicado: 2020
Acceso en línea:https://dx.doi.org/10.1016/j.rinp.2019.102890
http://cds.cern.ch/record/2730826

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