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Low material budget microfabricated cooling devices for particle detectors and front-end electronics

Novel cooling systems with very low material budget are being fabricated and studied. They consist of silicon wafers in which microchannels are etched and closed by bonding another wafer. This cooling option is being considered for future HEP dete ctors of the sLHC and linear colliders. It is curren...

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Detalles Bibliográficos
Autores principales: Mapelli, A, Catinaccio, A, Daguin, J, van Lintel, H, Nuessle, G, Petagna, P, Renaud, P
Lenguaje:eng
Publicado: 2011
Materias:
Acceso en línea:https://dx.doi.org/10.1016/j.nuclphysbps.2011.04.050
http://cds.cern.ch/record/2002979
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author Mapelli, A
Catinaccio, A
Daguin, J
van Lintel, H
Nuessle, G
Petagna, P
Renaud, P
author_facet Mapelli, A
Catinaccio, A
Daguin, J
van Lintel, H
Nuessle, G
Petagna, P
Renaud, P
author_sort Mapelli, A
collection CERN
description Novel cooling systems with very low material budget are being fabricated and studied. They consist of silicon wafers in which microchannels are etched and closed by bonding another wafer. This cooling option is being considered for future HEP dete ctors of the sLHC and linear colliders. It is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel detector and its front-end electronics where the microfabricated cooling plate would stand directly in the beam. In this particular case, microchannel cooling meets both the very aggressive X_0 (0.15%) specifications and the anticipated 2 W/cm^2 power dissipation by the active electronics.
id oai-inspirehep.net-918362
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2011
record_format invenio
spelling oai-inspirehep.net-9183622019-09-30T06:29:59Zdoi:10.1016/j.nuclphysbps.2011.04.050http://cds.cern.ch/record/2002979engMapelli, ACatinaccio, ADaguin, Jvan Lintel, HNuessle, GPetagna, PRenaud, PLow material budget microfabricated cooling devices for particle detectors and front-end electronicsDetectors and Experimental TechniquesNovel cooling systems with very low material budget are being fabricated and studied. They consist of silicon wafers in which microchannels are etched and closed by bonding another wafer. This cooling option is being considered for future HEP dete ctors of the sLHC and linear colliders. It is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel detector and its front-end electronics where the microfabricated cooling plate would stand directly in the beam. In this particular case, microchannel cooling meets both the very aggressive X_0 (0.15%) specifications and the anticipated 2 W/cm^2 power dissipation by the active electronics.oai:inspirehep.net:9183622011
spellingShingle Detectors and Experimental Techniques
Mapelli, A
Catinaccio, A
Daguin, J
van Lintel, H
Nuessle, G
Petagna, P
Renaud, P
Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title_full Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title_fullStr Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title_full_unstemmed Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title_short Low material budget microfabricated cooling devices for particle detectors and front-end electronics
title_sort low material budget microfabricated cooling devices for particle detectors and front-end electronics
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1016/j.nuclphysbps.2011.04.050
http://cds.cern.ch/record/2002979
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AT daguinj lowmaterialbudgetmicrofabricatedcoolingdevicesforparticledetectorsandfrontendelectronics
AT vanlintelh lowmaterialbudgetmicrofabricatedcoolingdevicesforparticledetectorsandfrontendelectronics
AT nuessleg lowmaterialbudgetmicrofabricatedcoolingdevicesforparticledetectorsandfrontendelectronics
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