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Low material budget microfabricated cooling devices for particle detectors and front-end electronics
Novel cooling systems with very low material budget are being fabricated and studied. They consist of silicon wafers in which microchannels are etched and closed by bonding another wafer. This cooling option is being considered for future HEP dete ctors of the sLHC and linear colliders. It is curren...
| Autores principales: | , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2011
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1016/j.nuclphysbps.2011.04.050 http://cds.cern.ch/record/2002979 |