Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes

For curing of fiber-reinforced epoxy composites, an alternative to thermal heating is the use of microwave energy, which cures quickly and consumes less energy. Employing thermal curing (TC) and microwave (MC) curing methods, we present a comparative study on the functional characteristics of fiber-...

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Detalles Bibliográficos
Autores principales: Haider, Imran, Gul, Iftikhar Hussain, Umer, Malik Adeel, Baig, Mutawara Mahmood
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10003988/
https://www.ncbi.nlm.nih.gov/pubmed/36902904
http://dx.doi.org/10.3390/ma16051790

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10003988/
https://www.ncbi.nlm.nih.gov/pubmed/36902904
http://dx.doi.org/10.3390/ma16051790

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