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Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
For curing of fiber-reinforced epoxy composites, an alternative to thermal heating is the use of microwave energy, which cures quickly and consumes less energy. Employing thermal curing (TC) and microwave (MC) curing methods, we present a comparative study on the functional characteristics of fiber-...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10003988/ https://www.ncbi.nlm.nih.gov/pubmed/36902904 http://dx.doi.org/10.3390/ma16051790 |